Electrelease M
Source: EIC Laboratories, Inc.
An intermediate strength electrically disbondable adhesive. After electrical disbonding, cured ELECTRELEASE M resin can be removed from solvent sensitive surfaces with methanol
An intermediate strength electrically disbondable adhesive. After electrical disbonding, cured ELECTRELEASE M resin can be removed from solvent sensitive surfaces with methanol. M bonds to most metals including aluminum and its alloys, steel, stainless steel, and copper. M is also used in conjunction with ELECTRELEASE FOIL PATCHES for solvent sensitive surfaces. It is supplied as a two-part kit. Typical properties are,
Contact EIC Laboratories to discuss specific properties for your application.
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Lap Shear Strength: |
2,000 psi (varies with surface finish of bonded parts) |
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Cure Conditions: |
2 hr at 80oC or 48 hr at room temperature |
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Disbonding Requirements: |
10-50 V DC. Maximum current ~5 mA/in2 decreasing to <1 mA/in2 after a few seconds |
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Disbonding Time: |
5 s to 20 minutes depending on voltage and load on bond |
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Pot-life: |
40 minutes for a 50 ml quantity |
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Shelf-life: |
>6 months at room temperature |
EIC Laboratories, Inc., 111 Downey Street, Norwood, MA 02062. Tel: 781-769-9450; Fax: 781-551-0283.