Engineered Conductive Materials To Exhibit DB-1541-X Series Adhesives At SNEC 2011

The DB-1541-X Series of Conductive Stringer Attach Adhesives features optimized rheology for jet dispensing, and excellent damp heat resistance and conductivity stability on tin, tin-silver and silver-plated ribbons.

Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, will showcase its DB-1541-X Series Conductive Stringer Attach Adhesives in Hall E7, Stand 655 at the upcoming SNEC International Photovoltaic Power Generation Conference & Exhibition, scheduled to take place February 22-24, 2011 at the Shanghai New International Expo Center in Shanghai, China.

The DB-1541-X Series of Conductive Stringer Attach Adhesives features optimized rheology for jet dispensing, and excellent damp heat resistance and conductivity stability on tin, tin-silver and silver-plated ribbons. The material features a rubber-like flexibility that is ideal for flexible photovoltaic applications with high peel strength to withstand stresses induced in the reel-to-reel manufacturing process.

Company representatives will be available at the show to discuss Engineered Conductive Materials' full line of conductive stringer attach adhesives, conductive adhesives for back contact crystalline silicon, thin-film and via fill applications, as well as conductive grid inks for photovoltaic applications.

Visit Hall E7, Stand 655 at the SNEC Expo to view Engineered Conductive Materials' vjet dispensing ideo and to learn how the company can define, develop and create an engineered material solution that is right for your company.

SOURCE: Engineered Conductive Materials, LLC