Epoxy Adhesives

Devcon®y Adhesives are formulated to bond rigid, durable substrates, such as metals, glass, ceramics, concrete and wood in all possible combinations. They cure at room temperature to a hard, clear bond within minutes of application. Nonshrinking, they make excellent sealing compounds. Devcon®y Adhesives are applied with easy-to-load, easy-to-use dispensers that preserve unused adhesive for the next application.

Designed for industrial applications that require fast acting, room temperature bonding,Devcon 5-Minute Epoxy is a rapid-curing, medium viscosity, general-purpose adhesive/encapsulant. It cures to a light amber color.

For applications where an extremely strong, clear, water-resistant bond is required, 2-Ton Clear Coat Epoxy is a high-clarity, nonshrink adhesive that forms a powerful bond with ferrous and nonferrous metals, ceramics, wood, concrete or glass in any combination. It provides superior gap filling for poorly mated surfaces and has a medium cure time.

Epoxy Plus 25 is a rubber-toughened structural adhesive with superior peel, impact, and fatigue resistance for bonding a wide array of substrates, including metals, FRP composites, rigid plastics, glass and wood. It is noncorrosive and can be used for potting and encapsulating electronic components.

When a high-performance, chemical resistant bond is desired, HP 250 is ideal for bonding or potting applications. A nonsagging thixotropic formulation, it will not run or drip when used on vertical or overhead applications. It provides resistance to a broad range of chemicals and is effective at temperatures up to 250° F.

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