High Temperature Adhesive Bonds Copper-To-Ceramic Torch Tips

Valley Cottage, NY - Aremco-Bond 570, a new high temperature, heat-curing nitrile-phenolic adhesive offered by Aremco Products, Inc., is now used to bond copper nozzles to ceramic insulators used in oxy/acetylene welding torches.

Aremco-Bond 570 is a single component, black pigmented, high temperature contact adhesive that exhibits excellent flexibility and resistance to thermal shock, chemical corrosion and water immersion. After a brief cure schedule, Aremco-Bond 570 withstands temperatures exceeding 600°F and provides tensile shear strength of 2,100 psi. Its coefficient of thermal expansion is 48 x 10-6 in/in/°F and viscosity is 35,000 cP at room temperature.

Aremco-Bond 570 is an easy-to-use material that can be spread with a plastic applicator or automatic dispense system. It is typically applied to each substrate to be bonded in thin layers of 10-15 mils. After the solvent is evaporated at room temperature for 15-20 minutes, the parts are then assembled and clamped. Curing is accomplished by heating to 180 ºF for 20-30 minutes.

The flexible nature of Aremco-Bond 570 enables it to bond together a wide range of materials including ceramics, metals, plastics, quartz, refractories, and friction materials at temperatures to 600F. This property provides manufacturers a direct method of attaching materials of different coefficients of expansion for use in thermal, structural and electrical applications throughout industry.

Aremco-Bond 570 is available from stock in pint, quart, and gallon containers. Please contact Aremco's Sales Engineering Department for more information about this advanced adhesive system.

SOURCE: AREMCO PRODUCTS, INC.