Low-Temperature Curing SMA
Source: Ellsworth Adhesive Systems
A one component, low temperature curing SMA is for high-speed syringe-dispense equipment
A one component, low temperature curing SMA is for high-speed syringe-dispense equipment (25,000-50,000 dots/hr). Low exotherm, low water absorption, high hot strength, and no stringing in high speed dispensing make Amicon D125 F an suitable adhesive for bonding a complete range of components, including chip capacitor & resistors, SOTs, SOICs, and PLCCs. The product produces a dome-shaped dot and is yellow in color.
Ellsworth Adhesive Systems, N117 W18711 Fulton Drive, Germantown, WI 53022-8202 Phone: 800-888-0698; Fax: 414-253-8619
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