One Part Silver Filled Electrically Conductive Epoxy Passes ISO 10993-5 Standard

Master Bond EP3HTSDA-2Med is a true one component epoxy that is not pre-mixed and frozen. It offers an easy dispensing profile with an exceptionally long working life at room temperature, making it ideal for streamlining automated assembly. As a silver filled system, it exhibits high electrical conductivity (volume resistivity < 0.001 ohm-cm) and excellent thermal conductivity. This epoxy passes ISO 10993-5 for cytotoxicity and is designed for high-speed medical device manufacturing.

EP3HTSDA-2Med cures quickly with heat. Cure schedule options include heating at 250°F for 20-30 minutes or 300°F for 5-10 minutes, with an optional post cure to optimize overall performance properties. The system bonds well to many substrates, including but not limited to metals, ceramics, plastics, and silicon dies.

EP3HTSDA-2Med has an excellent physical strength profile. It provides a tensile strength of 3,000-4,000 psi and a tensile modulus of 200,000-250,000 psi. It has a thermal conductivity of 45-49 BTU•in/(ft2•hr•°F) [6.5-7 W/(m·K)]. The filler particles used in this epoxy are exceptionally small, averaging 2-3 microns, and no larger than 25 microns. This allows for very thin bond lines, thereby providing effective heat transfer since it can offer a very low thermal resistance of 2-3 x 10-6 K•m2/W. This epoxy resists many sterilization methods such as glutaraldehyde, ethylene oxide (EtO) and gamma radiation.

The system is available in EFD syringes for automated dispensing or glass jars in 20 grams, 50 grams, 100 grams, 1 pound and multiple pounds.