OxySIM 530
Source: OxyChem Electronic Materials
OxySIM 530 series of one-part liquid encapsulants are designed for chip-on-board or potting applications
OxySIM 530 series of one-part liquid encapsulants are designed for chip-on-board or potting applications. OxySIM 530 encapsulants are based on a solventless bismaleimide (BMI) resin system which provides superior processing and performance, including a unique combination of long room temperature stability along with low curing temperatures. OxySIM 530 encapsulants have low modulus and very low water absorption, resulting in excellent reliability. An advantage of the OxySIM 530 over our OxySIM 540 is that even at high viscosity this product offers rapid dispense at very low pressures.
Custom formulation is also available.
Custom formulation is also available.
OxyChem Electronic Materials, Occidental Chemical Corporation, Technology Center, 2801 Long Road, Grand Island, NY 14072-1244. Tel: 716-773-8419; Fax: 716-773-8110.