Innovative Chemical Products Group (ICP Group) today announces that it has acquired Hi-Tech Coatings, a worldwide leading developer and manufacturer of high-performance coatings for the packaging and commercial printing industries, from Heidelberger Druckmaschinen AG (Heidelberg)
Master Bond EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively utilized for underfill and encapsulation applications. It does not need excessive heat for curing and has a long working life at room temperature
BOBST once again redefines technology and process support for customers by opening the first facility in the industry that enables converters and brand owners to carry out production tests and coating technology comparisons, certifying the results on site and calculating the costs related to each test from real production data
Siemens announced today that it has signed an agreement to acquire Atlas 3D, Inc., a Plymouth, Indiana-based developer of software that works with direct metal laser sintering (DMLS) printers to automatically provide design engineers with the optimal print orientation and requisite support structures for additive parts in near real-time
With Born2Bond™, Bostik brings a new range of innovative engineering adhesives designed for 'by-the-dot' bonding applications in selected industries, such as automotive, electronics, luxury packaging, medical devices, and MRO
Researchers at the University of Sussex have developed a glue which can unstick when placed in a magnetic field, meaning products otherwise destined for landfill, could now be dismantled and recycled at the end of their life.
KRAIBURG TPE has extended its portfolio of thermoplastic elastomers (TPEs) by additional efficient compounds. The four new THERMOLAST K types are primarily suited for sophisticated hard-soft composite components with high requirements in relation to surface quality and permanent weather resistance